The BGA Sunshine SS-101A Upgrade tool is designed for removing small components from the motherboard
and precise work on BGA chips (CPU, baseband, etc.). You use it when you need a thin, durable, and comfortable tool
that can easily penetrate between the chip and the board, without the risk of lifting the copper or damaging the pads.
Premium copper and aluminum materials ensure durability, and the pen-style design makes it easy to handle even during long work sessions.
The improved outer layer, with a diamond texture, provides a stable grip and comfort during use. The cross-opening chuck allows better control
and quick operation, making the tool ideal for GSM service, fine SMD interventions, IC prying, and solder joint repair.
Features:
- Professional tool for BGA repairs and IC removal
- Suitable for CPU, baseband, and small components on the motherboard
- Premium materials: high-quality copper + aluminum
- Wear-resistant, carefully polished finish
- Ergonomic pen-style design - light, compact, comfortable
- Diamond grip texture for anti-slip control
- Double-opening chuck (cross opening) for efficient operation
- Does not lift copper and reduces the risk of board damage
- Reduced thickness for working under the chip
- Usage recommendation: hot air 340-360 degrees C, air flow 28-30