Presentation
| Product range | iRepair MS1 |
| Product type | PCB Hotplate |
Sale package
| Pack | Blister |
| Content | PCB Hotplate / Work Supports |
| Product status | New |
Mijing iRepair MS1 PCB Hot Plate for
Apple iPhone X - 13 Series
The professional Mijing iRepair MS1 hot plate is an advanced tool designed for iPhone motherboard repair. Equipped with an improved heating element,
it ensures rapid heating and precise temperature control, providing safety and stability during the work process. It features a countdown timer function,
making the layering and fitting process safer and more efficient. It is the first hot plate to support layering for the iPhone 13 Series models, also compatible
with previous models, from iPhone X up to iPhone 13 Pro Max. The hot plate comes with a universal mode and a dot matrix mode, with the possibility
to receive unlimited upgrades for future models. It is an indispensable professional tool for repair shops, designed to
provide reliable support during the repair process.
Features:
- Improved heating element, fast and stable heating
- Precise temperature control
- Countdown function for safety in layering and fitting
- First hot plate compatible with iPhone 13 Series
- Supports iPhone X - 13 Pro Max
- Includes universal mode and dot matrix mode
- Unlimited upgrade possibility for new models
- Professional tool for PCB repairs
Package contents:
- PCB Hot Plate
- Work Supports